Package and printed circuit board attachment

ABSTRACT

Generally, the present disclosure provides example embodiments relating to a package that may be attached to a printed circuit board (PCB). In an embodiment, a structure includes a package. The package includes one or more dies and metal pads on an exterior surface of the package. At least some of the metal pads are first solder ball pads. The structure further includes pins, and each of the pins is attached to a respective one of the metal pads.

BACKGROUND

In the electronics industry, generally, integrated circuits are formedon semiconductor dies. The features of the integrated circuits on thesemiconductor dies are becoming progressively smaller with advances insemiconductor processing. Semiconductor dies (with integrated circuits)are commonly packaged in packages that contain an interconnect. Theinterconnect of the package can be formed as an integral part of thepackage or can be formed independently of other components of thepackage (such as a package substrate). The interconnect in the packagegenerally provides an interface between the integrated circuit of thesemiconductor die and another component.

Packages, and possibly other surface mount devices, can then be attachedto a printed circuit board (PCB). The PCB can be a substrate to whichany number of components is attached to form a system-level device, forexample.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a cross-sectional view of a package mechanically attached andelectrically coupled to a printed circuit board (PCB) in accordance withsome embodiments.

FIG. 2 is a cross-sectional view of a portion of the package substratein accordance with some embodiments.

FIG. 3 is a layout view of a corner portion of the package substrate inaccordance with some embodiments.

FIG. 4 is a cross-sectional view of a portion of the PCB in accordancewith some embodiments.

FIG. 5 is a layout view of a portion of the PCB in accordance with someembodiments.

FIGS. 6A and 6B are cross-sectional views of the package mechanicallyattached and electrically coupled to the PCB in accordance with someembodiments.

FIG. 7 is a flow chart for forming a package attached to a PCB inaccordance with some embodiments.

FIG. 8 is a flow chart for forming a package in accordance with someembodiments.

FIG. 9 is a flow chart for forming a PCB in accordance with someembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Generally, the present disclosure provides example embodiments relatingto a package that may be attached to a printed circuit board (PCB). Insome examples, the package and PCB are attached by using solder (e.g.,solder balls). The PCB and the package each have pads to which thesolder is to be attached. Some of the pads, such as pads at corners ofthe package layout, have respective pins attached thereto. The pins canreduce collapsing of the package on the PCB during a reflow process. Thereduced collapsing can reduce a risk of bridging and short circuiting ofsolder, particularly, at outer portions of the layout of the package.The risk of bridging and short circuiting may result from lateralbulging of the solder due to a reduced height of the solder caused bycollapsing during the reflow. Other benefits may be achieved.

Some variations of the example methods and structures are described. Aperson having ordinary skill in the art will readily understand othermodifications that may be made that are contemplated within the scope ofother embodiments. Although method embodiments may be described in aparticular order, various other method embodiments may be performed inany logical order and may include fewer or more steps than what isdescribed herein. In some figures, some reference numbers of componentsor features illustrated therein may be omitted to avoid obscuring othercomponents or features; this is for ease of depicting the figures.

FIG. 1 illustrates a cross-sectional view of a package 20 mechanicallyattached and electrically coupled to a PCB 22 in accordance with someembodiments. The package 20 includes a package substrate 24 and one ormore dies 26 on the package substrate 24. The one or more dies 26 areencapsulated on the package substrate 24 by an encapsulant 28, such as amolding compound.

The package 20 can be any package. As illustrated, the package 20includes a package substrate 24, but such a package substrate can beomitted in other examples, such as when the package has in integratedinterconnect like in an integrated fan-out package. The one or more dies26, which can include any appropriate integrated circuitry, can bemechanically attached and electrically coupled to the package substrate24 by any suitable technique. For example, the one or more dies 26 canbe mechanically attached and electrically coupled to the packagesubstrate 24 using flip chip technology. Controlled collapse chipconnects (C4) can be implemented on the one or more dies 26 and can beused to attach the one or more dies 26 to the package substrate 24. Inanother example, the one or more dies 26 can be mechanically attached tothe package substrate 24 by an adhesive and can be electrically coupledto the package substrate 24 by wire bonding. Any other technology can beused to mechanically attach and electrically couple the one or more dies26 to the package substrate 24. If more than one die 26 is included inthe package 20, any combination of technologies, e.g., flip chip, wirebonding, etc., can be implemented to mechanically attach andelectrically couple the dies 26 to the package substrate 24.

After the one or more dies 26 are mechanically attached and electricallycoupled to the package substrate 24, the one or more dies 26 areencapsulated on the package substrate 24. In some examples, the one ormore dies 26 are encapsulated by a molding compound using compressionmolding, transfer molding, or another molding process.

The package substrate 24 includes a number of metal layers that includevias and lines that route interconnections. The package substrate 24 canredistribute and/or interconnect various signals and/or componentsthrough the vias and/or lines of the metal layers. Additional details ofexample package substrates are described below.

The package 20 is mechanically attached and electrically coupled to thePCB 22 by solder balls 30. The solder balls 30 are or include alead-free solder, such as tin, silver, copper (Sn—Ag—Cu or SAC) solder,or another solder. Solder can be formed on pads of the package substrate24, such as by printing, plating, evaporation, or another process. Thepackage 20 can be placed on the PCB 22 such that the solder aligns withrespective pads on the PCB 22, and a reflow process can be performed toreflow the solder thereby forming the solder balls 30 that attach thepackage 20 to the PCB 22. Multiple packages can be mechanically attachedand electrically coupled to the PCB 22.

Further, pins 32 are attached to the package 20 at various locations onthe package 20, such as at outer areas in the layout of the package 20like at corners. The pins 32 each include a rigid material, such as ametal-containing material that has a melting point above the meltingpoint of the solder used for the solder balls 30. In some examples, thepins 32 are copper, gold plated copper, or the like. The pins 32 can beattached to pads on the package substrate 24, such as by soldering thepins 32 to respective pads or by metal bonding the pins 32 to respectivepads. The pins 32 can provide a mechanical support frame for the package20 during the reflowing of the solder balls 30 to prevent collapsing ofthe package 20. Additional details of the pins 32 are describedsubsequently.

The PCB 22 includes multiple metal layers that each includes lines,which may be interconnected between layers by through-hole connectors.The PCB 22 can redistribute and/or interconnect various signals and/orcomponents through the through-hole connectors and/or lines. The PCB 22with various packages attached thereto may implement a system or portionthereof. Additional details of example PCBs are described below.

FIG. 2 illustrates a cross-sectional view of a portion of the packagesubstrate 24. The package substrate 24 includes a core 40. The core 40provides mechanical strength and rigidity for the package substrate 24.The core 40, in some embodiments, is or includes a layer of pre-preg(e.g., a fiberglass matrix injected with an epoxy resin, such as FR-4).The layer of pre-preg can have a metal foil (e.g., copper foil) onopposing sides. Through-holes can be formed through the layer ofpre-preg and plated with a metal (e.g., copper) to form through-holeconnectors 42. The metal foil on the opposing sides can be etched usingphotolithography and etch processes to form metal lines on the opposingsides. Hence, the core 40 can include through-hole connectors 42electrically coupled to various metal lines 44, 46 on opposing sides ofthe core 40.

Various levels of insulating layers and metal layers are then formed onthe core 40. For convenience, “front-side” is used herein to designatethe side of the core 40 on which the one or more dies 26 are to beattached, and “back-side” is used herein to designate the side of thecore 40 opposite from the front-side.

As illustrated, a first front-side insulating layer 50 is formed on thecore 40 and metal lines 44. The first front-side insulating layer 50, insome examples, is an Ajinomoto Build-up Film (ABF) or the like, and islaminated or formed by another process on the core 40 and metal lines44. Via openings are formed through the first front-side insulatinglayer 50 to underlying metal lines 44 using laser drilling, for example.A metal seed layer is formed on the first front-side insulating layer50, such as by using physical vapor deposition (PVD), and a photoresistis formed and patterned over the metal seed layer. A plating process(such as electroless or electroplating) is performed to form metal lines52 and vias (not individually numbered) to connect the metal lines 52with the underlying metal lines 44. The photoresist is then removed,such as by using a wet stripping process, and the exposed metal seedlayer is removed, such as by a wet etching process. The metal seed layercan be or include copper, titanium, another metal, or a combinationthereof, and the metal lines 52 and vias can be or include copper,another metal, or a combination thereof. A second front-side insulatinglayer 54 and die-connection pads 56 with vias are formed on the firstfront-side insulating layer 50 and metal lines 52. The second front-sideinsulating layer 54 and die-connection pads 56 with vias can be formedusing the same processes as described with respect to the firstfront-side insulating layer 50 and metal lines 52 with vias. Thedie-connection pads 56 can be configured and arranged according to howthe one or more dies 26 are to be attached to the package substrate 24.For example, the die-connection pads 56 can be configured and arrangedto accommodate flip chip connections, wire bonding, or otherconnections.

A first back-side insulating layer 60 is formed on the core 40 and metallines 46. Metal lines 62 and vias (not individually numbered) are formedto connect the metal lines 62 with the underlying metal lines 46. Thefirst back-side insulating layer 60 and metal line 62 with vias can beformed using the same processes as described with respect to the firstfront-side insulating layer 50 and metal lines 52 with vias. A secondback-side insulating layer 64 and pads 66 with vias are formed on thefirst back-side insulating layer 60 and metal lines 62. The secondback-side insulating layer 64 and pads 66 with vias can be formed usingthe same processes as described with respect to the first front-sideinsulating layer 50 and metal lines 52 with vias. The pads 66 can beconfigured and arranged according to a ball grid array (BGA) matrix, forexample, on which the solder balls 30 can be formed.

The one or more dies 26 can be attached to the package substrate 24 atvarious times of forming the package substrate 24. For example, the oneor more dies 26 can be attached (such as by flip chip connections, wirebonding, etc.) on the front-side of the package substrate 24 afterback-side processing (e.g., forming back-side insulating layers 60, 64,metal lines 62, and pads 66) is performed. In other examples, the one ormore dies 26 can be attached on the front-side of the package substrate24 before back-side processing is performed. In such examples, the oneor more dies 26 can be attached on the front-side of the packagesubstrate 24 and encapsulated by the encapsulant 28 (such as describedabove) before back-side processing is performed.

The package substrate 24 is merely an example. Any number of insulatinglayers and metal layers including metal lines and vias can be formed onthe front-side and/or the back-side of the core. In some examples,package substrates can omit a core and any associated components. Apackage substrate can be formed by any process according to anytechnology.

FIG. 3 illustrates a layout view of a corner portion 24 a of the packagesubstrate 24 in accordance with some embodiments. In some examples, alayout of the package substrate 24 is rectangular, such as a square orrectangle. In such examples, the corner portion 24 a is representativeof each of the four corners in the layout of the package substrate 24.In the layout, pads 66 are arranged in a matrix comprising rows (asreferenced herein, x number of rows) and columns (as referenced herein,y number of columns). Although not necessarily illustrated, the matrixcan include pads 66 throughout the area of the matrix according to therows and columns, or can omit pads in some locations, such as in acenter area of the layout of the package substrate 24. As illustrated,the matrix includes rows of pads 66, where a first row includes pads66-1 j, a second row includes pads 66-2 j, a third row includes pads66-3 j, etc. (where j is 1 to y). The matrix includes columns of pads66, where a first column includes pads 66-i 1, a second column includespads 66-i 2, a third column includes pads 66-i 3, etc. (where i is 1 tox). A pitch P between neighboring pads 66 along a row or along a columncan be in a range from about 200 μm to about 1000 μm, such as about 1000μm. As illustrated in FIG. 3, the pitch P is between pads 66-51 and66-61 in a column, and is between pads 66-61 and 66-62 in a row. Thepads 66 have a first diameter D1, and have a first spacing S1 betweenneighboring pads 66 along a row or along a column. The first diameter D1plus the first spacing S1 is equal to the pitch P. The first diameter D1can be in a range from about 90 μm to about 600 μm, such as about 525μm, and the first spacing S1 can be in a range from about 100 μm toabout 500 μm, such as about 475 μm. Although described as having adiameter and being illustrated as circular, the pads 66 can have anygeometry, such as any polygon.

In the examples where the layout of the package substrate 24 isrectangular, the outer rows of the matrix of pads 66 (e.g., pads 66-1 jand 66-xj) and outer columns of the matrix of pads 66 (e.g., pads 66-i 1and 66-iy) also form a rectangular shape. Hence, the matrix of pads 66includes four corner pads 66-11, 66-1 y, 66-x 1, and 66-xy. Each of therespective four corner pads 66-11, 66-1 y, 66-x 1, and 66-xy is therespective pad 66 closest to a corner of the layout of the packagesubstrate 24. For example, as illustrated, the corner pad 66-11 is thepad 66 of the matrix closest to the corner 24 c of the layout of thepackage substrate 24. As will become apparent subsequently, corner pads66-11, 66-1 y, 66-x 1, and 66-xy may be attached to a pin 32 formechanical support during thermal cycling, and hence, these corner pads66-11, 66-1 y, 66-x 1, and 66-xy, in some examples, may not beelectrically connected to other electrically conductive features in thepackage substrate 24. In some examples, corner pads may be electricallyconnected to other electrically conductive features in the packagesubstrate 24.

In some examples, such as those illustrated in the figures and describedherein, a pin 32 is to be attached at each of the four corner pads66-11, 66-1 y, 66-x 1, and 66-xy. In other examples, pins 32 can beattached to other pads 66, such as along outer rows and/or columns ofthe matrix of pads. Any number of pins 32 may be implemented and may belocated at any location in the matrix. Further, one or more pin pads, towhich a respective pin can be attached, can be formed (similar to thepads 66) exterior to the matrix of pads 66, and the matrix can includepads 66 for attachment to any number of solder balls and pins or canomit any pads for attachment to any pin. For example, a pin pad can bealong the diagonal of the pads 66-44, 66-33, 66-22, and 66-11 and closerto the corner 24 c than any of the pads 66 in the matrix, particularly,closer to the corner 24 c than the pad 66-11.

FIG. 3 further illustrates a cross-section 6B that is illustrated infurther detail in FIG. 6B. The cross-section 6B is across pads 66-11,66-22, 66-33, and 66-44.

FIG. 4 illustrates a cross-sectional view of a portion of the PCB 22 inaccordance with some embodiments. The PCB 22 includes a number ofinsulating layers 80, 84, 88, 92, 96, 100, 104, 108, 112, 116, 120, and124 and a number of metal layers. The various metal layers asillustrated include metal lines 82, 86, 90, 94, 98, 102, 106, 110, 114,118, and 122. In some examples, the PCB 22 includes ten to thirtydifferent insulating layers with a metal layer disposed between eachneighboring pair of insulating layers.

In some examples, each of the insulating layers 80, 84, 88, 92, 96, 100,104, 108, 112, 116, 120, and 124 of the PCB 22 is or includes a layer ofpre-preg (e.g., a fiberglass matrix injected with an epoxy resin, suchas FR-4). The layer of pre-preg can initially have a metal foil (e.g.,copper foil) on one or both opposing sides. Each metal foil is patternedinto the corresponding metal lines 82, 86, 90, 94, 98, 102, 106, 110,114, 118, and 122 using photolithography and etch processes. After themetal foils are patterned to form corresponding metal lines, theinsulating layers are joined together. The insulating layers are alignedand pressed together to bond the insulating layers.

After the insulating layers are joined, through-hole connectors 126 areformed through the insulating layers. Holes can be formed through thejoined insulating layers using drilling, for example. After forming theholes, the joined insulating layers may be plated with a metal (e.g.,copper and/or tin). The plating forms the through-hole connectors 126 inthe holes and can also form a metal layer on the exterior surfaces ofthe joined insulating layers. The metal layers on the exterior surfacesare patterned. On an exterior surface, pads 128 with metal linesconnecting the pads 128 to the through-hole connectors 126 arepatterned. On another exterior surface, metal lines 130 or otherpatterns are patterned. The patterning of the pads 128 with metal linesand/or the metal lines 130 on the exterior surfaces can be implementedby photolithography and etching processes, and/or a photolithographyprocess and the plating that deposits the metal.

Solder masks (or solder resists) 132 and 134 are formed on respectiveexterior surfaces of the joined insulating layers. The solder masks 132and 134 can be patterned to expose an underlying metal pattern. Forexample, as illustrated, the solder mask 132 is patterned, using aphotolithography process, to define openings 136 that expose the pads128.

FIG. 5 illustrates a layout view of a portion 22 a of the PCB 22 inaccordance with some embodiments. In the layout, pads 128 are arrangedin a matrix comprising rows (as referenced herein, x number of rows) andcolumns (as referenced herein, y number of columns). The matrix of pads128 corresponds to the matrix of pads 66 on the package substrate 24.Although not necessarily illustrated, the matrix can include pads 128throughout the area of the matrix according to the rows and columns, orcan omit pads in some locations, such as in a center area of the layoutof the matrix. As illustrated, the matrix includes rows of pads 128,where a first row includes pads 128-1 j, a second row includes pads128-2 j, a third row includes pads 128-3 j, etc. (where j is 1 to y).The matrix includes columns of pads 128, where a first column includespads 128-i 1, a second column includes pads 128-i 2, a third columnincludes pads 128-i 3, etc. (where i is 1 to x). Each pad 128 is exposedthrough a respective opening 136 through the solder mask 132.

The pitch P is between neighboring pads 128 and/or openings 136 along arow or along a column. The pads 128 have a second diameter D2. Each ofthe openings 136 has a third diameter D3. The third diameter D3 isgreater than each of the second diameter D2. In some examples, thesecond diameter D2 is in a range from about 100 μm to about 550 μm, suchas about 525 μm, and the third diameter D3 is in a range from about 150μm to about 600 μm, such as about 575 μm. Although described as having adiameter and being illustrated as circular, the pads 128 can have anygeometry, such as any polygon.

Gaps are defined between the edges of pads 128 and respective sidewallsof the openings 136. The gaps have a second spacing S2 between the edgeof the pad 128 and the sidewall of the opening 136. In some examples,the second spacing S2 is in a range from about 15 μm to about 50 μm,such as about 25 μm. In other examples, the openings 136 can havevarying diameters, and/or the spacing of gaps formed in the openings 136can be equal or vary throughout the matrix. Although described as havinga diameter and being illustrated as circular, the openings 136 can haveany geometry, such as any polygon.

As illustrated and described the pads 128 are non-solder mask definedpads. The openings 136, as illustrated, are larger than the areas of thepads 128, which form the gaps between the edges of the pads 128 and thesidewalls of the opening 136. In other examples, the pads may be soldermask defined pads. In such examples, the openings 136 define the areasof the pads on which the solder balls are to be formed.

As previously stated, in some examples, a pin 32 is to be attached ateach of the four corner pads 66-11, 66-1 y, 66-x 1, and 66-xy. In thelayout of the PCB 22 in FIG. 5, corresponding pads 128 (e.g., pads128-11, 128-1 y, 128-x 1, and 128-xy) can be included in the matrix oromitted. Since pins 32 are attached to the respective pads 66 at theselocations, no electrical connection and no mechanical attachment is madeto the PCB 22 at these locations. The pins 32 may or may not contact thePCB 22, and the pins 32 may or may not be directly, permanently attachedto the PCB 22. A pad on the PCB 22 may be formed at each locationcorresponding to the placements of pins 32, which may be within thematrix and/or exterior to the matrix. Such pad(s) (if implemented) onthe PCB 22, in some examples, may not be electrically connected to otherelectrically conductive features in the PCB 22, while in some examples,such pad(s) may be electrically connected to other electricallyconductive features in the PCB 22. In other examples, the solder mask132 may be formed at locations corresponding to the placements of pins32. Other modifications and variations may be implemented.

FIG. 5 further illustrates a cross-section 6B that is illustrated infurther detail in FIG. 6B. The cross-section 6B is across pads 128-11,128-22, 128-33, and 128-44.

FIGS. 6A and 6B illustrate cross-sectional views of the package 20mechanically attached and electrically coupled to the PCB 22 inaccordance with some embodiments. FIG. 6B illustrates a corner portion140 shown in FIG. 6A. FIGS. 6A and 6B illustrate the package 20 and PCB22 after thermal cycling, such as after a reflow process to reflow thesolder balls 30. In some examples, a coefficient of thermal expansion(CTE) of the encapsulant 28 (e.g., molding compound) and/or othercomponents on the package substrate 24 is greater than a CTE of thepackage substrate 24. Hence, when the package 20 is heated during areflow process, the encapsulant 28 and/or other components can expand agreater amount than the package substrate 24. The difference in theamount of expansion can cause warpage of the package 20. As illustrated,when the encapsulant 28 and/or other components expand a greater amountthan the package substrate 24, a bottom surface of the package substrate24 (e.g., to which the solder balls 30 are attached) can become concave.Locations in the package 20 farthest from a center of the package 20 canexperience a greatest warpage deflection WD. For example, when a layoutof the package 20 is rectangular, such as described above, corners ofthe layout are generally the locations in the package 20 farthest fromthe center of the package 20, and hence, a greatest warpage deflectionWD can be observed at the corners. Even further, the larger the layoutof the package 20 is (such as for a 50 mm×50 mm layout), the larger thewarpage deflection WD can become.

When the warpage deflection WD occurs during reflowing of the solderballs 30, a volume available to outer solder balls, and moreparticularly, solder balls 30 proximate the corners, to flow can bedecreased. The warpage deflection WD can cause a height between pads 66on the package substrate 24 and pads 128 on the PCB 22 to decrease.Assuming that the pads 66 on the package substrate 24 have a sameattachment area and pitch and that the pads 128 on the PCB 22 have asame attachment area and pitch, solder balls 30 at the corners risklaterally bulging to accommodate the reduced height due to warpage. Thisbulging can cause bridging and short circuiting between solder balls 30.

According to some embodiments, pins 32 are positioned in variouslocations, such as along the periphery (e.g., corners), on the package20 to prevent some amount of collapse of the package 20 during thereflowing. The pins 32 can provide mechanical support to the package 20during the reflowing to prevent the collapse. For example, when thewarpage deflection WD occurs, the greatest warpage deflection WD can beat the corners of the package 20, which can cause more force (e.g.,weight of the package 20) to be applied on solder balls 30 proximate thecorners. This can cause the height of the solder balls 30 proximate thecorners to decrease and collapse. In some examples, pins 32 are locatedat the corners of the package, and when the solder balls begin tocollapse due to warpage, the pins 32 attached to the package 20 cancontact the PCB 22 to provide mechanical support to the package 20during the reflowing. This mechanical support can prevent furthercollapse of solder balls 30 and can reduce the risk of bulging and shortcircuiting between solder balls 30.

FIG. 6B illustrates some components illustrated in the layout views ofFIGS. 3 and 5. More specifically, FIG. 6B illustrates pads 66-11, 66-22,66-33, and 66-44 on the package substrate 24 shown in FIG. 3 and pads128-11, 128-22, 128-33, and 128-44 on the PCB 22 shown in FIG. 5. A pin32 is attached to the pad 66-11. Corresponding solder balls 30-22,30-33, and 30-44 are attached to the pads 66-22, 66-33, and 66-44 andthe pads 128-22, 128-33, and 128-44.

FIG. 6B further illustrates a first height H1 of the pin 32 at a cornerof the matrix and a second height H2 of the solder ball 30-22 proximatethe corner of the matrix. As illustrated, during reflowing of the solderballs 30, the second height H2 of the solder ball 30-22 may becomereduced due, in part, to the warpage of the package 20. As the secondheight H2 is reduced, the pin 32 is brought near to the pad 128-11 untilthe pin 32 contacts the pad 128-11. Once the pin 32 contacts the pad128-11, the pin 32 provides mechanical support to the package 20 toprevent further reduction in the second height H2. The pin 32 maintainsrigidity during the reflow process to provide the mechanical support.For example, if the pin 32 is metal, the metal of the pin 32 has ahigher melting point than the temperature used in the reflow process anda melting point of the solder balls 30. By preventing further reductionof the second height H2, further bulging of the solder ball 30-22 may beprevented, which can prevent short circuiting between solder balls 30.With multiple pins 32, the pins 32 may provide a mechanical supportframe for supporting the package 20 when the pins 32 contact the PCB 22.

The pin 32 illustrated in FIG. 6B is attached to the pad 66-11 usingsolder 142. In other examples, the pin 32 can be attached to the pad66-11 using a metal-to-metal bond or other mechanism. The pin 32 isillustrated as having a fourth diameter D4, which can be in a range fromabout 0.1 mm to about 0.2 mm. The first height H1 of the pin 32, in someexamples, is in a range from about 50% to about 80% of a lateraldiameter of any solder ball 30 and/or of an average middle, lateraldiameter of the solder balls 30. The first height H1 can vary dependingon placement of the pin 32. For example, if a pin 32 is more proximatethe center of the layout of the package 20, the larger the first heightH1 may be. The first height H1 may also take into consideration thedesign of the PCB 22. The first height H1, by being less than a diameterof one or more solder balls 30, can permit proper contact of the solderballs 30 to the pads 66 and the pads 128 during the reflowing of thesolder balls 30. As illustrated, the placement of the pin 32 correspondsto the pad 128-11 that is exposed by an opening 136 through the soldermask 132. In other examples, the placement of the pin 32 may have acorresponding location on the solder mask 132 on the PCB 22. Hence, insuch examples, the first height H1 may be reduced to account for thethickness of the solder mask 132 that the pin 32 may contact duringreflowing. The pin 32 is illustrated as being cylindrical, but this ismerely an example. The pin 32 can taper, can have a base attached to thepad 66 with an extending portion of any shape, or any other geometry.

Although the pins 32 have been described herein as being attached to thepackage 20 in various locations, in some examples, the pins 32 areattached to the PCB 22 instead of the package 20. In further examples,some pins 32 are attached to the package 20 while other pins 32 areattached to the PCB. The locations of the pins 32 in the variousexamples can vary as described previously.

FIG. 7 is a flow chart for forming a package attached to a PCB inaccordance with some embodiments. In operation 202, a package is formed,such as to be described subsequently with reference to FIG. 8. Inoperation 204, a PCB is formed, such as to be described subsequentlywith reference to FIG. 9. In operation 206, pins are attached to thepackage and/or the PCB. For example, pins can be attached by solder,metal-to-metal bonding, or another mechanism to respective pads on thepackage and/or PCB. In operation 208, the package is attached to thePCB. For example, solder can be formed on pads on the package and/or thePCB. The package can be placed on the PCB and aligned such that the padson the package align with appropriate pads on the PCB with the solderdisposed therebetween. The solder is then reflowed to form a morepermanent mechanical and electrical attachment between the pads of thepackage and the pads of the PCB.

FIG. 8 is a flow chart for forming a package in accordance with someembodiments. In operation 222, a core is formed with through-holeconnectors. The core can be formed as described above with respect toFIG. 2. In operation 224, front-side processing is performed to form oneor more insulating layers with one or more metal layers on thefront-side of the core. Any number of insulating layers and metal layersmay be formed on the front-side as described above with respect to FIG.2. In operation 226, back-side processing is performed to form one ormore insulating layers with one or more metal layers on the back-side ofthe core. Any number of insulating layers and metal layers may be formedon the back-side as described above with respect to FIG. 2. Theinsulating layers on the front-side and back-side, the metal layersdisposed in the insulating layers, and the core form a packagesubstrate. In operation 228, one or more dies are attached to thefront-side of the package substrate, such as described above withrespect to FIG. 2. In operation 230, the one or more dies areencapsulated on the front-side of the package substrate. For example, anencapsulant, such as a molding compound, may be used to encapsulate theone or more dies, such as by using compression molding, transfermolding, or another molding process.

FIG. 9 is a flow chart for forming a PCB in accordance with someembodiments. In operation 242, metal layers are formed on insulatinglayers. The metal layers (e.g., with patterned metal lines) can beformed on the insulating layers as described above with respect to FIG.4. In operation 244, the insulating layers with the metal layers can bejoined together, such as described above with respect to FIG. 4. Inoperation 246, through-hole connectors are formed through the joinedinsulating layers, such as described above with respect to FIG. 4. Theforming of the through-hole connectors may further form metal layers onexterior surfaces of the joined insulating layers. In operation 248,solder masks are formed on the exterior surfaces and are patterned toexpose pads.

Some embodiments can achieve advantages. For example, as describedabove, a risk of bridging and short circuiting of solder balls can bereduced, which can increase yield of packages attached to PCBs. Further,with the pins as disclosed in some embodiments, solder balls can beformed proximate corner portions of a layout of a package to increasethe number of inputs and/or outputs from the package with reduced riskof bridging and short circuiting.

An embodiment is a structure. The structure includes a package. Thepackage includes at least one die, and first solder ball metal pads onan exterior surface of the package, and pin metal pads on the exteriorsurface of the package. The structure further includes pins, and each ofthe pins is attached to a respective one of the pin metal pads.

Another embodiment is a structure. The structure includes a packagecomprising one or more dies, a printed circuit board (PCB), solderballs, and pins. The solder balls are disposed between the package andthe printed circuit board. The solder balls are attached to the packageand the printed circuit board. The pins are disposed between the packageand the printed circuit board. The pins are attached to the package.

A further embodiment is a method. Solder is disposed on first pads on aside of a package. The package includes one or more dies. Pins areattached on second pads on the side of the package.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: disposing solder on firstpads on a side of a package, the package including one or more dies; andattaching pins on second pads on the side of the package, wherein thefirst pads and the second pads together form a matrix on the side of thepackage, the second pads being in outer rows, outer columns, or acombination thereof of the matrix.
 2. The method of claim 1 furthercomprising attaching the package to a printed circuit board (PCB)comprising reflowing the solder.
 3. The method of claim 2, wherein thepins are metal having a higher melting temperature than a temperatureused during the reflowing the solder.
 4. The method of claim 1, whereinat least some the second pads being disposed in each corner of thematrix.
 5. The method of claim 1, wherein the pins are free of solder.6. A method comprising: forming a plurality of first pads on a packagesubstrate, the plurality of first pads being arranged in a matrix;forming a plurality of pins on a first set of the plurality of firstpads; and attaching the package substrate to a first substrate usingsolder joints formed between the plurality of first pads and a pluralityof second pads of the first substrate, wherein the first set of theplurality of first pads are free of the solder joints.
 7. The method ofclaim 6, wherein the first set of the plurality of first pads includepads in corners of the matrix.
 8. The method of claim 6 furthercomprising: prior to attaching the package substrate, forming solderballs on the plurality of second pads of the first substrate.
 9. Themethod of claim 6, wherein the first substrate comprises a plurality ofthird pads, wherein the plurality of pins are aligned with the pluralityof third pads.
 10. The method of claim 6, wherein a height of a firstpin of the plurality of pins is in a range from about 50% to about 80%of a lateral diameter a first solder joint of the solder joints.
 11. Themethod of claim 6, wherein a height of a first pin of the plurality ofpins is greater than a height of a second pin of the plurality of pins.12. The method of claim 11, wherein the first pin is closer to an edgeof the package substrate than the second pin.
 13. The method of claim 6,wherein sidewalls of the plurality of pins are tapered.
 14. The methodof claim 6, wherein the plurality of pins comprise a first material, thefirst material having a higher reflow temperature than the solderjoints.
 15. A method comprising: forming first pads on a firstsubstrate; forming pins on a first subset of the first pads, a secondsubset of the first pads being free of the pins; forming second pads ona second substrate, the second pads comprising a first subset of thesecond pads and a second subset of the second pads; forming soldermaterial on the second subset of the first pads or the second subset ofthe second pads; and attaching the first substrate to the secondsubstrate using solder material to form solder joints between the secondsubset of the first pads and the second subset of the second pads,wherein the pins are aligned with corresponding ones of the first subsetof the second pads.
 16. The method of claim 15, wherein the pins arepositioned in corners of a pattern formed by the first pads.
 17. Themethod of claim 15, wherein the pins comprise a metal material.
 18. Themethod of claim 15, wherein the pins contact corresponding ones of thefirst subset of the second pads.
 19. The method of claim 15, wherein thepins have a diameter in a range from about 0.1 mm to about 0.2 mm. 20.The method of claim 15, wherein the pins comprise a rigid materialhaving a higher reflow temperature than the solder material.